DUBLIN, April 26, 2023 /PRNewswire/ — The Automotive Cockpit SoC Research Report, 2023 has been added to ResearchAndMarkets.com’s offering.
In the trend towards cockpit and driving integration, the cockpit SoC is evolving towards the central computing SoC.
As intelligent driving technology matures, intelligent cockpits are playing an increasingly important role, and cockpit and driving integration are becoming the development trend. With the merging of cockpit, intelligent driving, power, chassis and body domains, the functions of some domains can first be integrated into a high-performance computing unit, then further functional domains can be aggregated step by step and finally a central computing model is created.
Currently, major vendors such as Bosch, ZF, Desay SV, EnjoyMove Technology, ThunderSoft, and SemiDrive have started designing solutions for central computing platforms.
Aurora, Desay SV’s intelligent computing platform product, integrates Nvidia Orin, Qualcomm SA8295 and Black Sesame A1000 chip hardware with a total performance of up to 2000TOPS. It also wraps CPU, GPU, and AI hardware through atomic operation for computing power sharing. As for the software, it integrates core functional domains such as intelligent cockpit, intelligent driving and connected services.
The Bosch Smart Cockpit and Driving Fusion hardware solution combines smart cockpit displays (approx. 7 screens), cameras, microphones and speakers on a single SoC and also integrates radar, camera and other sensors required for smart driving. The central computing task is performed by the universal computing module in the domain control unit, the redundancy concept is based on an MCU.
In the long term, with continuous breakthroughs in chip performance and technology, as the automotive EE architecture enters the “central computing” era, cockpit and intelligent driving chips are expected to merge, eventually forming a single high-performance chip-controlled model. In the current phase, Qualcomm and Nvidia, among others, have launched next-generation central computer SoC products to adapt to the booming smart car market.
At CES 2023, Qualcomm Snapdragon introduced the RideT Flex SoC, its latest SoC product, which is divided into the three tiers of Mid, High and Premium, of which the most advanced Ride Flex Premium SoC coupled with external AI accelerators, the comprehensive AI Computing power of 2000TOPS delivers . Designed to support mixed criticality workloads across heterogeneous compute resources, the Flex SoC is based on supercompute SoC and service-oriented architecture (SOA) to deliver digital cockpit, driver assistance, autonomous driving and telematics, and other functions in a distributed domain control architecture make possible.
Additionally, Qualcomm announced that multiple car brands have selected Snapdragon Ride Flex for their next-gen platform designs. The first Snapdragon Ride Flex SoC is now being sampled for an expected start of production from 2024.
It is conceivable that supercompute chips will enter the pre-installation cycle around 2025 and the core compute + zonal control architecture will be in the critical phase of large-scale production launch.
The pace at which foreign cockpit SoCs are being replaced by the homegrown Quicks, which are expected to be mass-produced and assembled in cars by 2023.
Given the huge market for intelligent cockpit SoCs, the new products from China’s local cockpit chip suppliers have offered significant improvements over the past two years. A number of self-developed cockpit SoC vendors have emerged, including Huawei, SemiDrive, Rockchip, AutoChips, SiEngine, UNISOC, and Allwinner Technology, and have a series of intelligent cockpit SoC products for the low, mid, and high-end – Markets launched. The goal is faster localization.
SemiDrive’s X9 series, an automotive-grade intelligent cockpit chip, integrates high-performance CPU, GPU and AI accelerator, as well as a video processor, meeting the increasing demand of new-generation electronic cockpit applications for large computing power and rich multimedia functions . X9 enables “one chip supporting ten screens” (generally 3 to 4 chips are required) and covers all cockpit functions such as dashboard, center console, electronic rear view mirror, entertainment, DMS, 360 degree surround view + APA and voice system away.
In addition to cockpit chips, SemiDrive’s products also include intelligent driving, central gateways and high-performance MCUs. In 2022, the deliveries of SemiDrive’s four main product series amounted to over one million units. In terms of automotive certification, SemiDrive has passed ISO 26262 functional safety certification of production process, AEC-Q100 reliability certification, ISO26262 functional safety certification and State Cryptography Administration certification, becoming China’s first automotive chip maker, who obtained the four certificates.
RK3588M, Rockchip’s latest flagship intelligent cockpit chip, adopts the 8nm process and integrates the octa-core CPU architecture, which consists of quad-core A76 and quad-core A55. It features 8K single-screen display capability, 8K video decoding and encoding, native six-screen display interfaces, 6 TOPS NPU, native 2-channel TypeC, and dual-channel 16-megapixel ISP + at least 12-channel camera and offers multi-system software including Android, Linux and QNX (hypervisor), with high computing power, low power consumption, powerful multimedia and numerous data interfaces.
Based on ultra-high-performance computing, the Rockchip RK3588M enables “a chip that supports multiple screens”, meaning a single RK3588M chip can drive multiple screens simultaneously, including the in-vehicle infotainment system, LCD instrument panel, electronic rear-view mirror and rear headrest screens. In addition, it also supports 360-degree surround view algorithm, enhanced image display, multiple audio and visual algorithms to build a reliable intelligent network system, providing users with scientific interaction experience.
Main topics covered:
1 Overview of Automotive Cockpit SoC
1.1 Cockpit SoC overview
1.2 Composition of Cockpit SoC
1.3 Cockpit SoC design flow
1.4 Development history of the Cockpit SoC
1.5 Comparison between common cockpit SoCs (I)
1.6 Comparison between common cockpit SoCs (II)
1.7 Comparison between common cockpit SoCs (III)
1.8 Ranking of cockpit SoCs by CPU processing power
1.9 Ranking of Cockpit SoCs by GPU Compute
1.10 Ranking of Cockpit SoCs by NPU Compute
1.11 Cockpit SoC memory specifications
1.12 Operating systems supported by Cockpit SoC
1.13 Displays and Cameras enabled by Cockpit SoC
1.14 Cockpit SoC automotive safety certification
1.15 Cockpit SoC Functional Safety Certification and Implementation Methodology
1.16 Planning of key companies for Cockpit SoC: Overseas
1.17 Planning of the main companies for Cockpit SoC: China
2 Automotive Cockpit SoC configuration and strategy analysis
2.1 Cockpit SoC Competitive Pattern
2.2 Cockpit SoC Configuration Strategies by Major OEMs
2.3 Installation of Qualcomm Cockpit SoCs in smart vehicles in China, 2022
3 Main Development Trends of Automotive Cockpit SoC
3.1 Topic 1: What will Qualcomm 8295 bring to the smart vehicle market?
3.2 Topic 2: Will server/PC solutions oppose the next generation cockpit SoC?
3.3 Topic 3: How to Realize Cockpit SoC Localization
3.4 Topic 4: What is the added value of developing cockpit SoC performance for vehicles?
3.5 Topic 5: How will cockpit SoC develop in the trend towards cockpit and driving integration?
4 foreign cockpit SoC companies
4.1 NXP
4.2 Texas Instruments (TI)
4.3 Renesas
4.4 Qualcomm
4.5 Intel
4.6 Samsung
4.7 Nvidia
4.8 Telechips
4.9AMD
5 Chinese cockpit SoC companies
5.1 Rockchip
5.2 SemiDrive
5.3 MediaTek
5.4 AutoChips
5.5 SiEngine Technology
5.6 Huawei Hisilicon
5.7 UNISOC
5.8 Allwinner Technology
6 Cockpit SoC Application Trends from OEMs
6.1 BYD
6.2 Tesla Cockpit SoC
6.3 BMW Cockpit SoC
6.4 Mercedes-Benz Cockpit SoC
6.5 Volkswagen Cockpit SoC
6.6 Audi Cockpit SoC
6.7 GM Cockpit SoC
6.8 Ford Cockpit SoC
6.9 Volvo Cockpit SoC
6.10 Toyota Cockpit SoC
6.11 Hyundai Cockpit SoC
6.12 Tata Cockpit SoC
6.13 Great Wall Motor Cockpit SoC
6.14 GAC Cockpit SoC
6.15 Changan Cockpit SoC
6.16 SAIC Cockpit SoC
6.17 Geely Cockpit SoC
6.18 BAIC Cockpit SoC
6.19 FAW Hongqi Cockpit SoC
6.20 Chery Cockpit SoC
6.21 Dongfeng Voyah Cockpit SoC
6.22 Li Auto Cockpit SoC
6.23 NIO Cockpit SoC
6.24 Xpeng Cockpit SoC
6.25 WM Cockpit SoC
6.26 Hozon Cockpit SoC
6.27 Human Horizons Cockpit SoC
6.28 Jump Motor Cockpit SoC
6.29 Nissan-Renault
6.30 honda
6.31 Jaguar Land Rover
For more information about this report, visit https://www.researchandmarkets.com/r/ubpeb9
About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with current data on international and regional markets, key industries, the top companies, new products and the latest trends.
Media contact:
research and markets
Laura Wood, Senior Manager
[email protected]
For EST office hours, call +1-917-300-0470
For US/CAN, call toll free +1-800-526-8630
For GMT office hours, call +353-1-416-8900
US Fax: 646-607-1907
Fax (outside the US): +353-1-481-1716
Logo: http://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg
SOURCE Research and Markets
