MediaTek has expanded its Dimensity chipset portfolio and launched the Dimensity 9200+ SoC for flagship 5G smartphones. The Taiwanese company said the new offering offers a performance boost over its predecessor while maintaining power efficiency for longer battery life and better gaming experiences.
MediaTek said that smartphones with Dimensity 9200+ are expected to launch in May 2023. However, the company did not announce the name of an OEM that will include the latest SoC in its offering.
“With the Dimensity 9200+, we continue to raise the bar for flagship performance and power efficiency, ensuring device manufacturers have access to the highest-performing mobile gaming capabilities available today,” said Yenchi Lee, associate general manager, Wireless Communications MediaTek Business Unit.
MediaTek Dimension 9200+ architecture
According to MediaTek, the Dimensity 9200+ supports higher clock speeds than its predecessor, the Dimensity 9200 chipset. The Dimensity 9200+ features an ultra-core Arm Cortex-X3 up to 3.35 GHz, three Arm Cortex-A715 super cores up to 3.0 GHz and four Arm Cortex-A510 efficiency cores with 2 .0 GHz.
MediaTek has boosted the chipset’s Arm Immortalis G715 GPU by 17% to give the SoC an extra boost for gaming and other compute-intensive applications.
“With faster ray tracing and smooth gameplay at high frame rates, combined with MediaTek’s power-saving technologies, you can enjoy incredible visuals, epic effects and longer battery life,” added Lee.
MediaTek Dimension 9200+ connectivity
The Dimensity 9200+ features a 4CC-CA 5G Release 16 modem that switches between sub-6GHz and mmWave connections, according to the company. In addition, the chipset also supports Wi-Fi 7 2×2 + 2×2 with a data rate of up to 6.5 Gbps and Bluetooth 5.3. It is equipped with MediaTek’s Bluetooth and Wi-Fi coexistence technology, which makes it possible to connect Wi-Fi, Bluetooth Low Energy (LE) audio and wireless peripherals simultaneously with low latency and no inferences.
MediaTek Dimensity 9200+ key features:
HyperEngine 6.0: MediaTek Dimensity 9200+ gets the HyperEngine 6.0, which is responsible for improving the gaming experience with adaptive performance technology.
4nm Manufacturing: The MediaTek Dimensity 9200+ is manufactured using TSMC’s second-generation 4nm-class process, making it an ideal proposition for “ultra-slim designs in various form factors”.
Sixth-generation AI processing unit (APU 690): MediaTek Dimensity 9200+ is said to efficiently perform AI noise reduction and AI super-resolution tasks for videos and bokeh shots.
Imagiq 890: MediaTek Dimensity 9200+ gets the Imagiq 890 image signal processor for bright, sharp images and videos even in low light conditions.
MediaTek MiraVision 890: The display technology should offer a smooth user experience.
MediaTek 5G UltraSave 3.0: The SoC features this energy efficiency technology to optimize battery life for 5G connection conditions.
