The GeekBench listing of the OPPO Find X6 Pro smartphone reveals the details of the chipset used in the device, its performance and also the operating system the phone runs on.
Read more about it below.
OPPO Find X6 Pro appears on GeekBench
Chinese smartphone brand OPPO is planning to release the OPPO Find X6 series devices in China later this month, and ahead of the launch, one of the devices in the series has appeared on the GeekBench list.
The series will consist of the OPPO Find X6 and OPPO Find X6 Pro smartphones, and the device that appeared on the GeekBench list is the OPPO Find X6 Pro smartphone. It also appeared with the model number PGEM10.
From the listing, the OPPO Find X6 Pro has a single-core score of 2000 points and a multi-core score of 5635 points.
It has also now been confirmed that the upcoming smartphone will feature Qualcomm’s top-of-the-line Snapdragon 8 Gen 2 chipset, as the listing reveals the smartphone’s motherboard codename as ‘kalama’, indicative of this chipset.
The device will also have an 8-core processor, of which the primary core will have a clock speed of 3.19 GHz. Four of the cores have a clock speed of 2.80 GHz and the other three cores have a clock speed of 2.02 GHz.
The smartphone will also run on the Color OS 13.1 custom user interface based on Android 13 and will have 16 GB of LPDDR5X RAM.
From what is known now, the upcoming smartphone is also expected to feature a 6.8-inch Samsung E6 AMOLED display with a screen resolution of 2K and a refresh rate of 120Hz. The display could also have a peak brightness of 2,500 nits.
A leaked alleged live image of the smartphone that came out earlier this week also reveals the rear camera setup of the upcoming OPPO Find X6 Pro smartphone.
OPPO Find X6 Pro
The next king of cameras. pic.twitter.com/sP1pfeJO9n
— Ice Universe (@UniverseIce) March 11, 2023
From the leaked live image of the smartphone, it appears that the OPPO Find X6 Pro has a circular camera module on its back with a triple rear camera and an LED flash on top of the camera module. The camera module can be divided into an upper and lower section, with the upper section housing two of the cameras and the LED flash. We also find HASSELBLAD branding on the underside of the top.
As for the lower part, the smartphone has placed one of its cameras here along with the MariSilicon branding. The camera in the lower part will probably also be the 1-inch camera sensor.
Further details about the smartphone are still pending and will be made available after the launch of the smartphone.
