The application-specific integrated circuit (ASIC) market is projected to reach $42.65 billion by 2032

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The global Application Specific Integrated Circuit (ASIC) market size was US$20.3 billion in 2022 and is expected to register a revenue CAGR of 8.6% by 2032

NEW YORK CITY, NEW YORK, UNITED STATES, March 8, 2023 / — The global application specific integrated circuit (ASIC) market size was US$20.3 billion in 2022 and is expected to grow at a CAGR- Sales up 8.6% over the forecast period, according to the latest Reports and Data report.

Increasing demand for high-performance computing solutions and technological advances in the semiconductor industry, such as the introduction of innovative materials, production methods, and design tools, are important factors driving the revenue growth of the market. Additionally, the growing number of industries such as automotive, aerospace, and military that require custom computer systems that can meet their specific needs, as well as the growing demand for high computing power are driving the revenue growth of the market.

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Some key highlights from the report

• During the forecast period, Full Custom is expected to account for a significant share of the market revenue. This is attributed to its increasing use in critical areas such as aerospace and defense where low power consumption and high performance are critical requirements.
• During the forecast period, the largest revenue shares in the ASIC chip market are expected to be held by the consumer electronics segment. This can be attributed to the increasing need for computing solutions that offer high performance and low power consumption. ASIC chips are used in various consumer electronic devices such as game consoles, laptops, tablets and smartphones.
• The largest share of sales during the projection period is expected to come from the North American market. This is because there is increased demand for high-performance computing systems across a variety of industries, including telecom, automotive, aerospace, and military. Other factors affecting the revenue growth of the market are the concentration of key semiconductor manufacturers in the region and the growing demand for new technologies such as 5G and self-driving cars.
• Some key companies featured in the global market report are Broadcom Inc., Qualcomm Technologies Inc., Samsung Electronics Co., Ltd., SK Hynix Inc., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Intel Corporation, Advanced Micro Devices Inc. (AMD), NVIDIA Corporation, Xilinx Inc., Microchip Technology Inc., Analog Devices Inc., NXP Semiconductors NV, Infineon Technologies AG., STMicroelectronics NV and Renesas Electronics Corporation
• Intel launched its latest 3rd generation Xeon Scalable CPU in April 2021, dubbed “Ice Lake”. Designed for use in data centers, the CPU uses Intel’s 10nm process technology and offers improved performance and energy efficiency.
• Xilinx launched the Versal HBM Adaptive Computation Acceleration Platform (ACAP) in March 2021. This platform uses High Bandwidth Memory (HBM) technology and is designed for use in applications such as 5G networks, cloud computing and AI.

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March 8, 2023 at 10:53 GMT

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